RHESCA : Solder checker

SOLDER CHECKER WET-6100		Download Catalog
For finematerial and accurate analysis solderability of soldering materials for electronic part.
WET-6100 is also good for the evaluation of Pb-free soldering materials, which have been the focus of attention these days.
	Compliant with both National and International standard.
	Wetting test and evaluation of solder paste for electronic chips in the temperature profile similar to that used for reflow soldering.
	Quick wetting test and evaluation of solder paste for electronic chip by rapid heating method
	Wetting test and evaluation of solder paste for electronic chips and through-holes using an
	aluminum block and soldering globule.
	PC-base anlysis including wetting time, wetting force, wetting angle and surface tension as well as multiple display of measured data.
	Wetting test and evaluation in N2 atmosphere.
	Applicability to dipping test and solder spreading test.

Operation :


The wetting balance method, primarily aimed at inspecting solderabillity of flow soldering, has been used over 20 years. An optional N2 chamber and a preheating block are also available. Compliant with JIS C0053 MIL-STD-833


In this method, a solder globule is used to cope with the difficulty involved in the wetting evaluation between molten solder and surface-mounted devices. Two kinds of globule heating blocks are prepared for sample size adjustment. Wetting test and evaluation concerning through-holes are also possible. Compliant with EIA ET-7401


With a test sample heated from above and bottom, a temperature raising process similar to that used in reflow soldering is realized for practical wetting test and evaluation. Testing in N2 atmosphere is also possible. Compliant with EIAJ ET-7404


For quick test and evaluation, solder paste and a surface-mounted device, which are brought together, are dipped and rapidly heated in molten solder. Compliant with EIAJ ET-7404

Software :

	Application software for finematerial and accurate analysis solderability of soldering materials. Measuring conditions Collective output Superimpose display Average data curve